Back Matter · Appendix A

Hardware Quick Reference & Cheat Sheet

GPU specifications · HBM generations · Interconnect bandwidth · 30 numbers every principal knows cold · Key formulas · Roofline ridge points · Parallelism rules · Production thresholds
Book: AI/ML Infrastructure from Silicon to Scale  |  Author: Venkat Vinjam  |  Cross-ref: Ch 1: Roofline Ch 3B: GPU roadmap Ch 4: HBM deep dive
How to use this appendix Every number here appears in at least one architecture review or interview. Know the starred ★ values cold — derive them from first principles, not memory. Specifications marked [SHIPPED] are from production hardware; [ANNOUNCED] are vendor-disclosed pre-GA; [ROADMAP] are directional estimates.

A.1 NVIDIA GPU Generation Comparison [SHIPPED]

GPUArchNodeBF16 TFLOPSFP8 TFLOPSFP4 TFLOPSHBM TypeHBM Cap.HBM BWNVLink BWTDP
V100 SXM2Volta12nm112N/AN/AHBM232 GB900 GB/s300 GB/s300W
A100 SXM4Ampere7nm312N/AN/AHBM2e80 GB2.0 TB/s600 GB/s400W
H100 SXM5 ★Hopper4N9891,979N/AHBM380 GB3.35 TB/s900 GB/s700W
H200 SXM5Hopper4N9891,979N/AHBM3e141 GB4.8 TB/s900 GB/s700W
B100 SXMBlackwell4NP1,8003,5007,000HBM3e192 GB8.0 TB/s1,800 GB/s700W
B200 SXMBlackwell4NP2,2504,5009,000HBM3e192 GB8.0 TB/s1,800 GB/s1,000W
GB200 NVL72Blackwell4NP2,250/GPU4,500/GPU9,000/GPUHBM3e192 GB/GPU8.0 TB/s130 TB/s rack1,000W/GPU
GB300 NVL72 [ROADMAP]Blk Ultra3nm est.~2,800~6,000~12,000HBM4288 GB12.0 TB/s130+ TB/s~1,400W

A.2 AMD GPU Comparison [SHIPPED]

GPUArchBF16 TFLOPSFP8 TFLOPSHBM TypeHBM Cap.HBM BWFabric BWTDPUnique Advantage
MI250XCDNA 2383N/AHBM2e128 GB3.28 TB/s800 GB/s500WDual-die, large memory
MI300X ★CDNA 31,307~2,614HBM3192 GB5.3 TB/s896 GB/s750WSingle-GPU 70B BF16 serving
MI325X [ANNOUNCED]CDNA 3+1,307~2,614HBM3e256 GB6.0 TB/s896 GB/s~1,000W256 GB — largest available
MI355X [ANNOUNCED]CDNA 4~2,600~5,200HBM3e288 GB~8.0 TB/s~1,500 GB/s~1,400WCDNA 4 compute jump
MI300X memory moat: 192 GB HBM3 fits LLaMA-3 70B (140 GB BF16) on a single GPU — H100/H200 require TP=2. At 100 serving instances that's 100 GPUs saved: $2.5M capex + $2.6M/year OpEx at $3/GPU-hr.

A.3 HBM Generation Reference

StandardBW / StackCap / StackPin RateBus WidthGPU Examples
HBM2256 GB/s8–16 GB2 Gbps1024-bitV100, MI100
HBM2e307 GB/s16 GB3.2 Gbps1024-bitA100, MI250X
HBM3 ★819 GB/s16 GB6.4 Gbps1024-bitH100, MI300X
HBM3e~1.2 TB/s24 GB9.6 Gbps1024-bitH200, B200, MI325X
HBM4 [ROADMAP]~2 TB/s32+ GB~16 Gbps1024-bit+GB300, MI400

A.4 Network Interconnect Reference [SHIPPED]

InterconnectBW (bidirectional)LatencyScopeAI Use CaseConstraint
NVLink 3.0 (A100)600 GB/s<1 µs8-GPU intra-nodeTensor ParallelismNVSwitch domain
NVLink 4.0 (H100) ★900 GB/s<1 µs8-GPU intra-nodeTP, Sequence ParallelismNVSwitch domain only
NVLink 5.0 (B200)1,800 GB/s<1 µs8-GPU intra-nodeTP, EP, SPNVSwitch domain only
NVLink-C2C (GB200)10,000 GB/s<1 µsCPU↔GPU same chipKV transfer, unified memorySame superchip only
NVLink Switch (NVL72)130 TB/s (rack total)<1 µs72-GPU rackFull mesh TP/EPOne rack = one "compute"
InfiniBand HDR50 GB/s/port~1 µsInter-nodePP, DP, AllReduceNot suitable for TP
InfiniBand NDR ★100 GB/s/port~1 µsInter-nodePP, DP, KV transferNot suitable for TP
InfiniBand XDR200 GB/s/port<1 µsInter-nodeNext-gen AllReduceEmerging 2025+
PCIe Gen5 x16128 GB/s~5 µsCPU↔GPUModel loading, checkpoints26× slower than HBM
TP over InfiniBand is unusable for inference. TP=8 AllReduce, 70B model, 80 layers, 0.5 GB per AllReduce: NVLink (900 GB/s) = 44ms overhead; IB NDR (50 GB/s) = 800ms overhead. TP must stay within the NVSwitch domain — non-negotiable.

A.5 Key Capacity Planning Formulas ★

MODEL PARAMETER MEMORY: model_bytes = N_params × bytes_per_param LLaMA-3 70B BF16: 70×10⁹ × 2 = 140 GB LLaMA-3 70B FP8: 70×10⁹ × 1 = 70 GB LLaMA-3 70B INT4: 70×10⁹ × 0.5 = 35 GB LLaMA-3 405B BF16: 405×10⁹ × 2 = 810 GB (requires TP=8 on H100, or 5× MI300X) KV CACHE MEMORY (per request): KV_bytes = 2 × L × H_kv × d_head × S × bytes_per_elem LLaMA-3 70B (L=80, H_kv=8, d_head=128, S=4096, BF16): = 2 × 80 × 8 × 128 × 4096 × 2 = 5.37 GB per concurrent request Per token per layer: 2 × H_kv × d_head × 2 = 2×8×128×2 = 4 KB TPOT MINIMUM (bandwidth-limited, batch=1): TPOT_min = model_bytes / HBM_bandwidth H100 BF16: 140 GB / 3.35 TB/s = 41.8 ms ★ H200 BF16: 140 GB / 4.8 TB/s = 29.2 ms B200 BF16: 140 GB / 8.0 TB/s = 17.5 ms MI300X BF16: 140 GB / 5.3 TB/s = 26.4 ms H100 INT4: 35 GB / 3.35 TB/s = 10.4 ms (4× speedup from quantization) PREFILL FLOPS (rule of thumb): FLOPs_prefill ≈ 2 × N_params × S (sequence length) LLaMA-3 70B, S=2048: 2 × 70×10⁹ × 2048 = 286 TFLOP On H100 (989 TFLOPS, 50% MFU): 286 / (989 × 0.5) = 578 ms MFU: MFU = (FLOPs_per_step × steps/s) / Peak_TFLOPS World-class: >55% | Good: 40–55% | Poor: <25% | Critical: <10% ALLREDUCE TIME (ring algorithm): t = 2 × (N−1)/N × M / BW [M = message bytes, N = GPUs, BW = link BW] TP=8, M=256 MB, NVLink=900 GB/s: t = 2×(7/8)×256e6/900e9 = 0.50 ms FLEET SIZING: raw_GPUs = peak_tok/s / (1000/TPOT_ms × batch_at_SLA) total_GPUs = raw_GPUs / 0.75 × 1.20 (75% util target, 20% burst headroom)

A.6 Parallelism Quick Reference

StrategyWhat is ShardedComm PatternBW RequiredScale LimitBest For
Data Parallelism (DP)Gradients onlyAllReduceIB acceptableModel fits 1 GPUHigh throughput training
ZeRO-1Optimizer statesAllGather before fwdIB acceptableLow comm overheadOptimizer memory relief
ZeRO-3 / FSDPWeights + optimizer + gradsAllGather + ReduceScatterIB acceptable (3× comm)Heaviest commLargest models, memory tight
Tensor Parallelism (TP)Weight matricesAllReduce per layerNVLink mandatoryNVSwitch domain (≤8)Inference latency, very large
Pipeline Parallelism (PP)Layers across stagesP2P activationsIB acceptableBubble = (PP−1)/(PP+M−1)Cross-node training scale
Sequence Parallelism (SP)Sequence dim activationsAllGather + ReduceScatterNVLink preferredRequires TPLong context training
Expert Parallelism (EP)MoE expert weightsAll-to-All tokensIB+ acceptableLoad balance criticalMoE at scale

A.7 Numerical Precision Reference

FormatBitsExpMantissaRangeGPU SupportTypical Use
FP3232823±3.4×10³⁸AllOptimizer states, loss scaling accumulator
BF16 ★1687±3.4×10³⁸A100+Training activations + weights (default)
FP1616510±65,504V100+Legacy training; loss scaling required
FP8 E4M3 ★843±448H100+Forward pass weights + activations
FP8 E5M2852±57,344H100+Backward pass gradients
INT88——−128 to 127AllLLM.int8(), SmoothQuant inference
INT4 / GPTQ4——−8 to 7AllMemory-limited inference, AWQ
NVFP4 [SHIPPED]421block-scaledB200+Blackwell-native training + inference

A.8 The 30 Numbers Every Principal Knows Cold ★

COMPUTE: H100 BF16: 989 TFLOPS H100 FP8: 1,979 TFLOPS H200 BF16: 989 TFLOPS B200 FP8: 4,500 TFLOPS B200 FP4: 9,000 TFLOPS MI300X BF16: 1,307 TFLOPS GB300 FP4: ~12,000 TFLOPS [ROADMAP] HBM CAPACITY AND BANDWIDTH: H100: 80 GB | 3.35 TB/s ★ H200: 141 GB | 4.8 TB/s B200: 192 GB | 8.0 TB/s MI300X: 192 GB | 5.3 TB/s ★ GB300: 288 GB | 12.0 TB/s [ROADMAP] RIDGE POINTS (FLOP/byte, the regime boundary): A100: 156 H100: 295 ★ H200: 206 B200: ~281 MI300X: 247 INTERCONNECT: NVLink 4.0 (H100): 900 GB/s ★ NVLink 5.0 (B200): 1,800 GB/s NVLink-C2C (GB200): 10,000 GB/s IB NDR (per port): 50 GB/s ★ PCIe Gen5 x16: 64 GB/s (one-way GPU↔CPU) MODEL MEMORY — LLAMA-3 70B: BF16: 140 GB ★ FP8: 70 GB INT4: 35 GB Single-GPU fit (BF16): MI300X only ★ (192 GB vs 140 GB needed) LLaMA-3 405B BF16: 810 GB → min TP=8 on H100 (640 GB total) TPOT MINIMUMS — LLAMA-3 70B, batch=1: H100 BF16: 41.8 ms ★ H200 BF16: 29.2 ms MI300X: 26.4 ms B200: 17.5 ms H100 INT4: 10.4 ms ★ (4× speedup from quantization alone) KV CACHE — LLAMA-3 70B, GQA, 4K context, BF16: Per request: 5.37 GB ★ Per token per layer: 4 KB PRODUCTION THRESHOLDS: Max GPU utilization: 80% ★ Max KV cache: 80% ★ MFU world-class: >55% MFU poor: <25% P99/P50 TTFT alarm: >5× ★ Queue time alarm: >200ms P99 SDC rate (10K H100): ~1/2 weeks Continuous batch gain: 10–30×

A.9 Roofline Ridge Points by GPU and Precision

GPUBF16 RidgeFP8 RidgeHBM BWKey Implication
V100124 FLOP/byteN/A900 GB/sMost transformers compute-bound (low ridge)
A100156 FLOP/byteN/A2.0 TB/sLarge GEMM still compute-bound
H100 ★295 FLOP/byte590 FLOP/byte3.35 TB/sMany ops now memory-bound vs V100
H200206 FLOP/byte412 FLOP/byte4.8 TB/sLower ridge — BW-rich, compute same
B200~281 FLOP/byte~562 FLOP/byte8.0 TB/sHigher compute + higher BW
MI300X ★247 FLOP/byte~493 FLOP/byte5.3 TB/sLower ridge than H100 — bandwidth-rich
H200 insight: H200 has a LOWER ridge (206) than H100 (295) despite identical TFLOPS — because HBM bandwidth increased without adding compute. Ops that are just barely compute-bound on H100 may become memory-bound on H200. Re-classify every kernel's regime at each GPU generation transition.

A.10 MFU Reference Table

WorkloadModelGPUMFU RangeNotes
LLM Pretraining (well-tuned)LLaMA-3 70BH10045–52%Megatron-LM, 4D parallel
LLM PretrainingGPT-4 class TP=8 PP=16H10040–48%NVIDIA MLPerf Training
Inference Prefill (TRT-LLM)LLaMA-3 70B, FP8, batch=32H10050–65%Compute-bound at large batch
Inference Decode (batch=1)LLaMA-3 70B, BF16H1003–8%Bandwidth floor — expected and correct
Inference Decode (batch=64)LLaMA-3 70B, BF16H10030–45%Approaching ridge point
RLHF / PPO70B policy + 70B rewardH10015–30%Memory constraints limit batch
Fine-tuning (LoRA r=64)7BA10025–40%Small batch, frequent I/O
Appendix A Complete  ·  AI/ML Infrastructure from Silicon to Scale  ·  Venkat Vinjam  ·  2026